Inner Layer DES Systems
97.0%+
Develop & etch uniformity
4.0+
Etch factor ratio
0–5
m/min adjustable speed
620 mm
Maximum panel width
TTST Mindway Horizontal DES Systems
Engineered for high-uniformity chemical delivery and rapid rinsing across thin inner-layer cores without mechanical distortion or fluid pooling.
Chingking Pumice Scrubbing System
Provides controlled surface micro-roughness to optimize photoresist adhesion and surface cleanliness prior to fine-line exposure.
Precision Control Parameters
Designed to meet stringent electrical and geometry standards for high-density interconnect multilayer boards.
Fine-Line Etching
Fluid Management
Thin Core Transport
Optimized manifold geometry maintains uniform trace definition down to 25 micron line widths across large-format panels.
Continuous chemical analysis and automatic replenishment ensure consistent etch rate across multi-shift fabrication runs.
Ultra-low-tension segmented rollers carry flexible and ultra-thin substrates down to 0.05 mm thickness safely.
Configure Your DES Line
Speak with Visnex application engineers to request custom module configurations, chemical compatibility charts, or production quotes.